Integrated Circuit, Hybrid, and Multichip Module Package Design Guidelines: A Focus on Reliability

Circuit designers, packaging engineers, printed board fabricators, and procurement personnel will find this book's microelectronicpackage design-for-reliability guidelines and approaches essentialfor achieving their life-cycle, cost-effectiveness, and on-timedelivery goals.

Its uniquely organized, time-phased approach to design, development, qualification, manufacture, and in-service managementshows you step-by-step how to:
* Define realistic system requirements in terms of mission profile, operating life, performance expectations, size, weight, and cost
* Define the system usage environment so that all operating, shipping, and storage conditions, including electrical, thermal, radiation, and mechanical loads, are assessed using realistic data
* Identify potential failure modes, sites, mechanisms, andarchitecture-stress interactions--PLUS appropriate measures you cantake to reduce, eliminate, or accommodate expected failures
* Characterize materials and processes by the key controllablefactors, such as types and levels of defects, variations inmaterial properties and dimensions, and the manufacturing andassembly processes involved
* Use experiment, step-stress, and accelerated methods to ensureoptimum design before production begins


Detailed design guidelines for substrate...wire and wire, tapeautomated, and flip-chip bonding...element attachment and case, lead, lead and lid seals--incorporating dimensional and geometricconfigurations of package elements, manufacturing and assemblyconditions, materials selection, and loading conditions--round outthis guide's comprehensive coverage. Detailed guidelines forsubstrate...wire and wire, tape automated, and flip-chipbonding...element attachment and case, lead, lead and lidseals--incorporating dimensional and geometric configurations ofpackage elements, manufacturing and assembly conditions, materialsselection, and loading conditions--round out this guide'scomprehensive coverage.

of related interest...

PHYSICAL ARCHITECTURE OF VLSI SYSTEMS --Allan D. Kraus, RobertHannemann and Michael Pecht

For the professional engineer involved in the design andmanufacture of products containing electronic components, here is acomprehensive handbook to the theory and methods surrounding theassembly of microelectronic and electronic components. The bookfocuses on computers and consumer electronic products with internalsubsystems that reflect mechanical design constraints, costlimitations, and aesthetic and ergonomic concerns. Taking a totalsystem approach to packaging, the book systematically examines: basic chip and computer architecture
design and layout
interassembly and interconnections
cooling scheme
materialsselection, including ceramics, glasses, and metals
stress, vibration, and acoustics
and manufacturing and assemblytechnology. 1994 (0-471-53299-1) pp.

SOLDERING PROCESSES AND EQUIPMENT --Michael G. Pecht

This comprehensive, fundamentals first handbook outlines thesoldering methods and techniques used in the manufacture ofmicroelectronic chips and electronic circuit boards. In a clear, easy-to-access format, the book discusses: soldering processes andclassification
the material dynamics of heat soldering whenassembling differing materials
wave and reflow soldering
controlling contamination during manufacturing cleanings
techniques for assuring reliability and quality control duringmanufacturing
rework, repair, and manual assembly
the modernassembly / repair station
and more. The book also provides clearguidelines on assembly techniques as well as an appendix of varioussolder equipment manufacturers.

1993 (0-471-59167-X) 312 pp.