3D Stacked Chips

Name: 3D Stacked Chips
Brand: Springer International Publishing AG
SKU: 9783319793054
Price: 1120 CZK
Availability: InStock

From Emerging Processes to Heterogeneous Systems

Autor: IBRAHIM AB ELFADEL

Jazyk:

Vazba: Brožovaná

Vydavatel: Springer International Publishing AG

Dostupnost: Skladem u dodavatele

Odesíláme za 5-8 dnů

1 120 Kč

This book explains for readers how 3D chip stacks promise to increase the level of on-chip integrati...

Informace o knize

Autor

IBRAHIM AB ELFADEL

Jazyk

Angličtina

Vazba

Kniha - Brožovaná

Vydáno

2018

Stránek

339

EAN

9783319793054

ISBN

9783319793054

Enbook ID

19684593

Vydavatel

Springer International Publishing AG

Hmotnost

5504

Rozměry

155 x 235 x 20

Kompletní popis

This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.

Mohlo by vás zajímat

Zákaznicí kteří koupili tuto knihu koupili také

Nejčastěji hledané

Categories

Authors

Publishers

Produkty

Produkty

Nejčastěji hledané

Categories

Authors

Publishers

Produkty

Produkty

3D Stacked Chips

From Emerging Processes to Heterogeneous Systems

Informace o knize

Kompletní popis

Mohlo by vás zajímat

Zákaznicí kteří koupili tuto knihu koupili také