Kniha 3D Stacked Chips Ibrahim M. Elfadel

3D Stacked Chips

From Emerging Processes to Heterogeneous Systems

Jazyk: Angličtina
Vazba: Pevná
Dostupnost: Skladem u dodavatele
Odesíláme za 10-13 dnů
1 120
This book explains for readers how 3D chip stacks promise to increase the level of on-chip integrati...

Informace o knize

Jazyk
Angličtina
Vazba
Kniha - Pevná
Vydáno
2016
Stránek
339
EAN
9783319204802
ISBN
3319204807
Enbook ID
09339827
Hmotnost
694
Rozměry
241 x 166 x 26

Kompletní popis

This book explains for readers how 3D chip stacks promise to increase the level of on-chip integration, and to design new heterogeneous semiconductor devices that combine chips of different integration technologies (incl. sensors) in a single package of the smallest possible size. The authors focus on heterogeneous 3D integration, addressing some of the most important challenges in this emerging technology, including contactless, optics-based, and carbon-nanotube-based 3D integration, as well as signal-integrity and thermal management issues in copper-based 3D integration. Coverage also includes the 3D heterogeneous integration of power sources, photonic devices, and non-volatile memories based on new materials systems.

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