Transient Study on Heat Dissipation Problem in Microelectronics

Name: Transient Study on Heat Dissipation Problem in Microelectronics
Brand: LAP LAMBERT Academic Publishing
SKU: 9786202556989
Price: 789 CZK
Availability: InStock

Autor: Raghavendraprabhu S, Muthumohan C

Jazyk:

Vazba: Brožovaná

Vydavatel: LAP LAMBERT Academic Publishing

Dostupnost: Skladem u dodavatele

Odesíláme za 5-8 dnů

789 Kč

The concern about thermal performance of microelectronics is on the increase due to recent over-heat...

Informace o knize

Autor

Raghavendraprabhu S, Muthumohan C

Jazyk

Angličtina

Vazba

Kniha - Brožovaná

Vydáno

2020

Stránek

EAN

9786202556989

ISBN

6202556986

Enbook ID

32908668

Vydavatel

LAP LAMBERT Academic Publishing

Hmotnost

Rozměry

152 x 229 x 3

Kompletní popis

The concern about thermal performance of microelectronics is on the increase due to recent over-heating induced failures which have led to product recalls. Removal of excess heat from microelectronic systems with the use of heat sinks could improve thermal efficiency of the system. Challenges posed for the modeling of thermal phenomena in microelectronics from optimizing IC packaging thermal performance, assembly processes and reliability testing to predicting operational temperature in application environments. Precise thermal analysis is essential for designing an effective thermal management system of modern electronic devices such as batteries, LEDs, microelectronics, ICs, circuit boards, semiconductors and heat spreaders. The need for smaller, faster and lighter products has put considerable demands on the thermal management of microelectronics. This paper outlines the issues in thermal management of consumer and aerospace electronics. Some typical solutions for complex high-end systems are presented. The role of the thermal interface material is a key to the thermal management of high performance consumer electronics.

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Transient Study on Heat Dissipation Problem in Microelectronics

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