Kniha Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices SUHIR

Avoiding Inelastic Strains in Solder Joint Interconnections of IC Devices

Autor: SUHIR
Jazyk: Angličtina
Vazba: Pevná
Dostupnost: Skladem u dodavatele
Odesíláme za 9-15 dnů
5 272
The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlyi...

Informace o knize

Autor
Jazyk
Angličtina
Vazba
Kniha - Pevná
Vydáno
2021
Stránek
382
EAN
9781138624733
ISBN
113862473X
Enbook ID
32905881
Hmotnost
754
Rozměry
241 x 167 x 31

Kompletní popis

The book addresses analytical (mathematical) modeling approaches aimed at understanding the underlying physics and mechanics of the behavior and performance of solder materials and solder joint interconnections of IC devices. The emphasis is on design for reliability, including probabilistic predictions of the solder lifetime.

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