Coupled Data Communication Techniques for High-Performance and Low-Power Computing

Name: Coupled Data Communication Techniques for High-Performance and Low-Power Computing
Brand: Springer-Verlag New York Inc.
SKU: 9781441965875
Price: 3937 CZK
Availability: InStock

Autor: Ron Ho, Robert Drost

Jazyk:

Vazba: Pevná

Vydavatel: Springer-Verlag New York Inc.

Dostupnost: Skladem u dodavatele v malém množství

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This book provides an overview of the circuits, architectures, and chip packaging for coupled data t...

Informace o knize

Autor

Ron Ho, Robert Drost

Jazyk

Angličtina

Vazba

Kniha - Pevná

Vydáno

2010

Stránek

206

EAN

9781441965875

ISBN

1441965874

Enbook ID

01424016

Vydavatel

Springer-Verlag New York Inc.

Hmotnost

498

Rozměry

163 x 241 x 20

Kompletní popis

This book provides an overview of the circuits, architectures, and chip packaging for coupled data techniques. It discusses the current research in chip-to-board capacitive coupling, chip-to-chip capacitive coupling, chip-to-chip inductive coupling, and chip-to-chip optical coupling. Circuits, modeling, and their implications for packaging are explored in depth. Mechanical methods to ensure accurate and sustained chip alignment are discussed, as well as electrical methods to compensate for resulting misalignment. Finally, the book covers issues raised by design for manufacturing and test. §This book is one of the first in a new and emerging area. Coupled data communication offers new ways of looking at the old problem of limited off-chip I/O: it trades off packaging complexity for I/O performance; it offers a set of enabling technologies for 3D or stacked-chip architectures; and it raises the possibility of replace-able chips--and thus high yield--in an MCM.

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Coupled Data Communication Techniques for High-Performance and Low-Power Computing

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