Electrical Modeling and Design for 3D System Integration - 3D Integrated Circuits and Packaging Signal Integrity, Power Integrity and EMC

Name: Electrical Modeling and Design for 3D System Integration - 3D Integrated Circuits and Packaging Signal Integrity, Power Integrity and EMC
Brand: John Wiley & Sons Inc
SKU: 9780470623466
Price: 3088 CZK
Availability: InStock

Autor: Er-Ping Li

Jazyk:

Vazba: Pevná

Vydavatel: John Wiley & Sons Inc

Dostupnost: Skladem u dodavatele v malém množství

Odesíláme za 11-15 dnů

3 088 Kč

The first book to address electromagnetic modeling methodologies for analysis of the large complex e...

Informace o knize

Autor

Er-Ping Li

Jazyk

Angličtina

Vazba

Kniha - Pevná

Vydáno

2012

Stránek

384

EAN

9780470623466

ISBN

0470623462

Enbook ID

04884809

Vydavatel

John Wiley & Sons Inc

Hmotnost

774

Rozměry

156 x 241 x 18

Kompletní popis

The first book to address electromagnetic modeling methodologies for analysis of the large complex electronic structures, Efficient Electromagnetic Modeling for High Speed Electronics systematically reviews a series of fast and efficient electromagnetic modeling techniques. The book presents a number of special methods to solve the SI, PI, and EMI problems and provides an overview of the existing electromagnetic modeling methods used in electronic chips, package, and PCB. The text also addresses the limitations individuals in the real-world engineering community face for design engineers, researchers, postgraduates, postdoctoral researchers, university professors, and consultants.

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Electrical Modeling and Design for 3D System Integration - 3D Integrated Circuits and Packaging Signal Integrity, Power Integrity and EMC

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Kompletní popis

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