Electronic Packaging for High Reliability, Low Cost Electronics

Name: Electronic Packaging for High Reliability, Low Cost Electronics
Brand: Springer
SKU: 9780792352181
Price: 3426 CZK
Availability: InStock

Autor: Rao R. Tummala, Marija Kosec, W. Kinzy Jones, Darko Belavic

Jazyk:

Vazba: Pevná

Vydavatel: Springer

Dostupnost: Skladem u dodavatele

Odesíláme za 10-13 dnů

3 426 Kč

Integrated circuits are expected to increase their speed and power dramatically and rapidly. New pac...

Informace o knize

Autor

Rao R. Tummala, Marija Kosec, W. Kinzy Jones, Darko Belavic

Jazyk

Angličtina

Vazba

Kniha - Pevná

Vydáno

2000

Stránek

296

EAN

9780792352181

ISBN

0792352181

Enbook ID

01395791

Vydavatel

Springer

Hmotnost

1360

Rozměry

155 x 235 x 21

Kompletní popis

Integrated circuits are expected to increase their speed and power dramatically and rapidly. New packaging techniques are required if the devices are to remain within cost and size constraints. The present volume addresses new hermetic packaging, new materials for thermal management and assembly, and new components that integrate multiple functions (embedded substrates and component arrays), while retaining previous high levels of reliability. The book embraces many developments in fundamental materials science and manufacturing processes of discrete components, as well as developments in high speed, high integration packaging and more complex embedded component technologies.

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Electronic Packaging for High Reliability, Low Cost Electronics

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