Kniha Electronic Packaging Materials and Their Properties Rahul Mahajan

Electronic Packaging Materials and Their Properties

Autor: Rahul Mahajan
Jazyk: Angličtina
Vazba: Pevná
Dostupnost: Skladem u dodavatele
Odesíláme za 10-13 dnů
5 919
Examines the array of packaging architecture, outlining the classification of materials and their us...

Informace o knize

Jazyk
Angličtina
Vazba
Kniha - Pevná
Vydáno
1998
Stránek
128
EAN
9780849396250
ISBN
9780849396250
Enbook ID
06684927
Hmotnost
354
Rozměry
156 x 234 x 12

Kompletní popis

Examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. This book discusses applications such as interconnections, printed circuit boards, substrates, encapsulants, dielectrics, die attach materials, electrical contacts, thermal materials, and solders.

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