Electronic Packaging Materials Science X: Volume 515

Name: Electronic Packaging Materials Science X: Volume 515
Brand: Materials Research Society
SKU: 9781558994218
Price: 620 CZK
Availability: PreOrder

Autor: Daniel J. BeltonMichael GaynesElizabeth G. JacobsRaymond Pearson

Jazyk:

Vazba: Pevná

Vydavatel: Materials Research Society

Dostupnost: Očekávaný dotisk

Termín neznámý

620 Kč

Advanced packaging applications are demanding increasingly more innovative materials sets in order t...

Informace o knize

Autor

Daniel J. BeltonMichael GaynesElizabeth G. JacobsRaymond Pearson

Jazyk

Angličtina

Vazba

Kniha - Pevná

Vydáno

1998

Stránek

262

EAN

9781558994218

ISBN

1558994211

Enbook ID

02060166

Vydavatel

Materials Research Society

Hmotnost

614

Rozměry

157 x 234 x 23

Kompletní popis

Advanced packaging applications are demanding increasingly more innovative materials sets in order to ensure overall package reliability. In addition, as we migrate towards higher-density inter-connects, the assembly operation will require new processes and process materials to guarantee both performance and manufacturability. This book explores the questions of materials, processes and reliability for high-density package solutions. The book is strengthened by invited and contributed papers from a host of national and international experts. Topics include: interfacial adhesion behavior; flip-chip interconnections; high-density substrates; thermomechanical behavior and packaging reliability issues.

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Electronic Packaging Materials Science X: Volume 515

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