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Kniha Embedded Dielectrics for Electronic Packaging Shuhui Yu

Embedded Dielectrics for Electronic Packaging

Autor: Shuhui Yu, Ching-Ping Wong, Rong Sun
Jazyk: Angličtina
Vazba: Pevná
Vydavatel: World Scientific Publishing Co Pte Ltd
Dostupnost: Očekávaná novinka
Vydání 31. 03. 2027
4 020 Kč
This book provides an overview of nanocomposite materials that can be used as embedded dielectric la...

Informace o knize

Autor
Shuhui Yu, Ching-Ping Wong, Rong Sun
Jazyk
Angličtina
Vazba
Kniha - Pevná
Vydáno
2015
Stránek
300
EAN
9789814619417
ISBN
9814619418
Enbook ID
05349964
Vydavatel
World Scientific Publishing Co Pte Ltd
Hmotnost
406

Kompletní popis

This book provides an overview of nanocomposite materials that can be used as embedded dielectric layer in high-density electronic packaging, for decoupling, filtering, energy storage or electrostatic discharge suppressing etc. Some fundamental models used to analyze or predict the dielectric behavior of ceramic/polymer, conductor/polymer, and semiconductor/polymer composites are reviewed. This book also introduces design and synthesis of some novel hybrid filler particles, as well as graft modification on the polymer matrix to improve dielectric performance.

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