Kniha Encapsulation Materials for Neural Interface Devices Jui-Mei Hsu

Encapsulation Materials for Neural Interface Devices

Autor: Jui-Mei Hsu
Jazyk: Angličtina
Vazba: Brožovaná
Vydavatel: VDM Verlag
Dostupnost: Skladem u dodavatele
Odesíláme za 9-15 dnů
1 583
Neural interface devices have been developed for §neuroscience and neuroprosthetics applications to...

Informace o knize

Autor
Jazyk
Angličtina
Vazba
Kniha - Brožovaná
Vydáno
2009
Stránek
184
EAN
9783639140750
ISBN
3639140753
Enbook ID
06822710
Vydavatel
Hmotnost
277
Rozměry
152 x 229 x 11

Kompletní popis

Neural interface devices have been developed for §neuroscience and neuroprosthetics applications to §record and stimulate nerve signals. Chronic use of §these devices is prevented by their lack of long-§term stability, due to device failure or immune §system responses. §Conformal, hermetic, biocompatible, and electrically §insulating coating materials that sustain chronic §implantation and guarantee stable recording or §stimulation are needed. Even though a large §selection of materials has been proposed and tested §for this purpose, to date, no material §presented in scientific literature has been §thoroughly characterized and qualified as a long-§term hermetic encapsulation material for silicon-§based neural interface devices. §In this work, hydrogenated amorphous silicon carbide §(a-SiCx:H) and Parylene-C films were investigated as §the encapsulation materials. The deposition §parameters and corresponding film properties were §explored and correlated with the encapsulation §characteristics.

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