High Performance Design Automation For Multi-chip Modules And Packages

Name: High Performance Design Automation For Multi-chip Modules And Packages
Brand: World Scientific Publishing Co Pte Ltd
SKU: 9789810223076
Price: 2320 CZK
Availability: InStock

Autor: Paul D Franzon

Jazyk:

Vazba: Pevná

Vydavatel: World Scientific Publishing Co Pte Ltd

Dostupnost: 50 % šance

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2 320 Kč

Today's electronics industry requires new design automation methodologies that allow designers to in...

Informace o knize

Autor

Paul D Franzon

Jazyk

Angličtina

Vazba

Kniha - Pevná

Vydáno

1996

Stránek

264

EAN

9789810223076

ISBN

9810223072

Enbook ID

05065166

Vydavatel

World Scientific Publishing Co Pte Ltd

Hmotnost

359

Kompletní popis

Today's electronics industry requires new design automation methodologies that allow designers to incorporate high performance integrated circuits into smaller packaging. The aim of this book is to provide current and future techniques and algorithms of high performance multichip modules and other packaging methodologies. Technical papers in this issue cover: design optimization and physical partitioning; global routing/multi-layer assignment; timing-driven interconnection design (timing models, clock and power design); crosstalk, reflection, and simultaneous switching noise minimization; yield optimization; defect area minimization; low-power physical layout; design methodologies. Two tutorial reviews review some of the most significant algorithms previously developed for the placement/partitioning, and signal integrity issues, respectively. The remaining articles review the trend of prime design automation algorithms to solve the above eight problems arisen in MCM and other packages.

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High Performance Design Automation For Multi-chip Modules And Packages

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