Integrated Circuit Failure Analysis - A Guide to Preparation Techniques

Name: Integrated Circuit Failure Analysis - A Guide to Preparation Techniques
Brand: John Wiley & Sons Inc
SKU: 9780471974017
Price: 4908 CZK
Availability: InStock

Autor: Friedrich Beck

Jazyk:

Vazba: Pevná

Vydavatel: John Wiley & Sons Inc

Dostupnost: Skladem u dodavatele

Odesíláme za 10-18 dnů

4 908 Kč

Fault analysis of highly-integrated semiconductor circuits has become an indispensable discipline in...

Informace o knize

Autor

Friedrich Beck

Jazyk

Angličtina

Vazba

Kniha - Pevná

Vydáno

1998

Stránek

190

EAN

9780471974017

ISBN

0471974013

Enbook ID

04895159

Vydavatel

John Wiley & Sons Inc

Hmotnost

396

Rozměry

162 x 239 x 16

Kompletní popis

Fault analysis of highly-integrated semiconductor circuits has become an indispensable discipline in the optimization of product quality. Integrated Circuit Failure Analysis describes state-of-the-art procedures for exposing suspected failure sites in semiconductor devices. The author adopts a hands-on problem-oriented approach, founded on many years of practical experience, complemented by the explanation of basic theoretical principles. Features include: Advanced methods in device preparation and technical procedures for package inspection and semiconductor reliability. Illustration of chip isolation and step-by-step delayering of chips by wet chemical and modern plasma dry etching techniques. Particular analysis of bipolar and MOS circuits, although techniques are equally relevant to other semiconductors. Advice on the choice of suitable laboratory equipment. Numerous photographs and drawings providing guidance for checking results. Focusing on modern techniques, this practical text will enable both academic and industrial researchers and IC designers to expand the range of analytical and preparative methods at their disposal and to adapt to the needs of new technologies.

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Integrated Circuit Failure Analysis - A Guide to Preparation Techniques

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