Kniha Introduction to Microsystem Packaging Technology Jing Chen

Introduction to Microsystem Packaging Technology

Autor: Jing Chen
Jazyk: Angličtina
Vazba: Pevná
Dostupnost: 50 % šance
Prohledáme celý svět
5 748
Illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced s...

Informace o knize

Autor
Jazyk
Angličtina
Vazba
Kniha - Pevná
Vydáno
2010
Stránek
232
EAN
9781439819104
ISBN
9781439819104
Enbook ID
06699473
Hmotnost
574
Rozměry
253 x 180 x 19

Kompletní popis

Illustrates developments in microsystem packaging (MSP) design and manufacture, including advanced substrate and interconnection technology. This book also details 3D-package and system-level package development with a decidedly MEMS perspective. It presents various technologies in relation to MSP.

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