Manufacturing Challenges in Electronic Packaging

Name: Manufacturing Challenges in Electronic Packaging
Brand: Chapman and Hall
SKU: 9780412620300
Price: 2286 CZK
Availability: InStock

Autor: Y.C. Lee, W.T. Chen

Jazyk:

Vazba: Pevná

Vydavatel: Chapman and Hall

Dostupnost: Skladem u dodavatele

Odesíláme za 10-13 dnů

2 286 Kč

This book provides a single source reference that addresses both advanced packaging and manufacturin...

Informace o knize

Autor

Y.C. Lee, W.T. Chen

Jazyk

Angličtina

Vazba

Kniha - Pevná

Vydáno

1997

Stránek

261

EAN

9780412620300

ISBN

0412620308

Enbook ID

01386673

Vydavatel

Chapman and Hall

Hmotnost

1250

Rozměry

155 x 235 x 20

Kompletní popis

This book provides a single source reference that addresses both advanced packaging and manufacturing activities, enhanced by reviews and in-depth analysis. The common theme throughout the book is how to manufacture with only one defective package in a million escaping undetected. The book will become the most important reference for professionals who need to meet this goal through their design and manufacturing activities.

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Manufacturing Challenges in Electronic Packaging

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Kompletní popis

Mohlo by vás zajímat

Zákaznicí kteří koupili tuto knihu koupili také