Kniha Materials Reliability Issues in Microelectronics: Volume 225 James R. LloydFrederick G. YostPaul S. Ho

Materials Reliability Issues in Microelectronics: Volume 225

Jazyk: Angličtina
Vazba: Pevná
Dostupnost: Očekávaný dotisk
Termín neznámý
828
With the increased complexity of modern integrated circuits, it is important that reliability proble...

Informace o knize

Jazyk
Angličtina
Vazba
Kniha - Pevná
Vydáno
1991
Stránek
382
EAN
9781558991194
ISBN
1558991190
Enbook ID
02059930
Hmotnost
700
Rozměry
155 x 235 x 25

Kompletní popis

With the increased complexity of modern integrated circuits, it is important that reliability problems be attacked properly with the appropriate tools. This volume recognizes that almost all reliability problems are materials problems, and helps to put 'reliabilty physics' on a firm scientific foundation. Topics include: electromigration; stress effects on reliability; stress and packaging; metallization; device, oxide and dielectric reliability; new investigative techniques; corrosion.

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