Kniha Power Electronic Packaging Yong Liu

Power Electronic Packaging

Design, Assembly Process, Reliability and Modeling

Autor: Yong Liu
Jazyk: Angličtina
Vazba: Brožovaná
Dostupnost: Skladem u dodavatele
Odesíláme za 5-8 dnů
5 706
This in-depth view of varied aspects of power electronic packaging systematically introduces design,...

Informace o knize

Autor
Jazyk
Angličtina
Vazba
Kniha - Brožovaná
Vydáno
2014
Stránek
594
EAN
9781489987976
ISBN
1489987975
Enbook ID
06841507
Hmotnost
926
Rozměry
155 x 235 x 33

Kompletní popis

This in-depth view of varied aspects of power electronic packaging systematically introduces design, assembly, reliability and failure analysis and materials selection, as well as covering the most advanced simulation and modeling techniques in the field.§

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