Reliability Technology for Integrated Circuit Packaging

Name: Reliability Technology for Integrated Circuit Packaging
Brand: Springer-Verlag GmbH
SKU: 9789819538843
Price: 3571 CZK
Availability: InStock

Autor: Yunfei En, Si Chen

Jazyk:

Vazba: Pevná

Vydavatel: Springer-Verlag GmbH

Dostupnost: Skladem u dodavatele

Odesíláme za 10-13 dnů

3 571 Kč

This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms,...

Informace o knize

Autor

Yunfei En, Si Chen

Jazyk

Angličtina

Vazba

Kniha - Pevná

Vydáno

2026

Stránek

509

EAN

9789819538843

ISBN

981953884X

Enbook ID

49699488

Vydavatel

Springer-Verlag GmbH

Hmotnost

1010

Kompletní popis

This book consists of ten chapters on IC packaging technologies, covering failure modes, mechanisms, advanced structures and reliability methods, with a focus on materials, structure and stress.

Reliability, a key indicator of product quality, spans multiple disciplines such as materials science and electronics. In China's pursuit of "high-quality development" a focus on reliability is essential to advancing manufacturing.

Written by a leading expert from the State Key Laboratory, this book is important for improving the performance of electronic products and supporting the growth of China's electronic information industry.

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