RF and Microwave Microelectronics Packaging II

Name: RF and Microwave Microelectronics Packaging II
Brand: Springer International Publishing AG
SKU: 9783319847191
Price: 2275 CZK
Availability: InStock

Autor: KEN KUANG

Jazyk:

Vazba: Brožovaná

Vydavatel: Springer International Publishing AG

Dostupnost: Skladem u dodavatele

Odesíláme za 10-18 dnů

2 275 Kč

This book presents the latest developments in packaging for high-frequency electronics. It is a comp...

Informace o knize

Autor

KEN KUANG

Jazyk

Angličtina

Vazba

Kniha - Brožovaná

Vydáno

2018

Stránek

172

EAN

9783319847191

ISBN

9783319847191

Enbook ID

19737758

Vydavatel

Springer International Publishing AG

Hmotnost

2934

Rozměry

155 x 235 x 11

Kompletní popis

This book presents the latest developments in packaging for high-frequency electronics. It is a companion volume to "RF and Microwave Microelectronics Packaging" (2010) and covers the latest developments in thermal management, electrical/RF/thermal-mechanical designs and simulations, packaging and processing methods, and other RF and microwave packaging topics. Chapters provide detailed coverage of phased arrays, T/R modules, 3D transitions, high thermal conductivity materials, carbon nanotubes and graphene advanced materials, and chip size packaging for RF MEMS. It appeals to practicing engineers in the electronic packaging and high-frequency electronics domain, and to academic researchers interested in understanding the leading issues in the commercial sector. It is also a good reference and self-studying guide for students seeking future employment in consumer electronics.

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RF and Microwave Microelectronics Packaging II

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