Semiconductor Advanced Packaging

Name: Semiconductor Advanced Packaging
Brand: Springer Verlag, Singapore
SKU: 9789811613784
Price: 2679 CZK
Availability: InStock

Autor: John H. Lau

Jazyk:

Vazba: Brožovaná

Vydavatel: Springer Verlag, Singapore

Dostupnost: Skladem u dodavatele

Odesíláme za 5-8 dnů

2 679 Kč

The book focuses on the design, materials, process, fabrication, and reliability of advanced semicon...

Informace o knize

Autor

John H. Lau

Jazyk

Angličtina

Vazba

Kniha - Brožovaná

Vydáno

2022

Stránek

498

EAN

9789811613784

Enbook ID

39124513

Vydavatel

Springer Verlag, Singapore

Hmotnost

789

Rozměry

155 x 235 x 28

Kompletní popis

The book focuses on the design, materials, process, fabrication, and reliability of advanced semiconductor packaging components and systems. Both principles and engineering practice have been addressed, with more weight placed on engineering practice. This is achieved by providing in-depth study on a number of major topics such as system-in-package, fan-in wafer/panel-level chip-scale packages, fan-out wafer/panel-level packaging, 2D, 2.1D, 2.3D, 2.5D, and 3D IC integration, chiplets packaging, chip-to-wafer bonding, wafer-to-wafer bonding, hybrid bonding, and dielectric materials for high speed and frequency. The book can benefit researchers, engineers, and graduate students in fields of electrical engineering, mechanical engineering, materials sciences, and industry engineering, etc.

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Semiconductor Advanced Packaging

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