SiP System-in-Package Design and Simulation

Mentor EE Flow Advanced Design Guide

Autor: Liu Yang

Jazyk:

Vazba: Pevná

Vydavatel: John Wiley and Sons Ltd

Dostupnost: Skladem u dodavatele

Odesíláme za 10-18 dnů

3 214 Kč

An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design fl...

Informace o knize

Autor

Liu Yang

Jazyk

Angličtina

Vazba

Kniha - Pevná

Vydáno

2017

Stránek

496

EAN

9781119045939

ISBN

9781119045939

Enbook ID

10918283

Vydavatel

John Wiley and Sons Ltd

Hmotnost

896

Rozměry

252 x 177 x 30

Kompletní popis

An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: Cavity and sacked dies design FlipChip and RDL design Routing and coppering 3D Real-Time DRC check SiP simulation technology Mentor SiP Design and Simulation Platform Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.

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SiP System-in-Package Design and Simulation

Mentor EE Flow Advanced Design Guide

Informace o knize

Kompletní popis

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