Solder Joint Reliability Prediction for Multiple Environments

Name: Solder Joint Reliability Prediction for Multiple Environments
Brand: Springer-Verlag New York Inc.
SKU: 9780387793931
Price: 2567 CZK
Availability: InStock

Autor: Andrew E. Perkins, Suresh K. Sitaraman

Jazyk:

Vazba: Pevná

Vydavatel: Springer-Verlag New York Inc.

Dostupnost: Skladem u dodavatele v malém množství

Odesíláme za 11-15 dnů

2 567 Kč

Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, gradu...

Informace o knize

Autor

Andrew E. Perkins, Suresh K. Sitaraman

Jazyk

Angličtina

Vazba

Kniha - Pevná

Vydáno

2008

Stránek

192

EAN

9780387793931

ISBN

0387793933

Enbook ID

01383161

Vydavatel

Springer-Verlag New York Inc.

Hmotnost

489

Rozměry

155 x 235 x 16

Kompletní popis

Solder Joint Reliability Prediction for Multiple Environments will provide industry engineers, graduate students and academic researchers, and reliability experts with insights and useful tools for evaluating solder joint reliability of ceramic area array electronic packages under multiple environments. The material presented here is not limited to ceramic area array packages only, it can also be used as a methodology for relating numerical simulations and experimental data into an easy-to-use equation that captures the essential information needed to predict solder joint reliability. Such a methodology is often needed to relate complex information in a simple manner to managers and non-experts in solder joint who work with computer server applications as well as for harsh environments such as those found in the defense, space, and automotive industries.

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Solder Joint Reliability Prediction for Multiple Environments

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