Solder Joint Reliability

Name: Solder Joint Reliability
Brand: Van Nostrand Reinhold Inc.,U.S.
SKU: 9780442002602
Price: 5079 CZK
Availability: InStock

Theory and Applications

Autor: John H. Lau

Jazyk:

Vazba: Pevná

Vydavatel: Van Nostrand Reinhold Inc.,U.S.

Dostupnost: Skladem u dodavatele v malém množství

Odesíláme za 13-18 dnů

5 079 Kč

Solders have given the designer of modern consumer, commercial, and military electronic systems a re...

Informace o knize

Autor

John H. Lau

Jazyk

Angličtina

Vazba

Kniha - Pevná

Vydáno

1991

Stránek

631

EAN

9780442002602

ISBN

0442002602

Enbook ID

01387441

Vydavatel

Van Nostrand Reinhold Inc.,U.S.

Hmotnost

2400

Rozměry

155 x 235 x 33

Kompletní popis

Solders have given the designer of modern consumer, commercial, and military electronic systems a remarkable flexibility to interconnect electronic components. The properties of solder have facilitated broad assembly choices that have fueled creative applications to advance technology. Solder is the electrical and me chanical "glue" of electronic assemblies. This pervasive dependency on solder has stimulated new interest in applica tions as well as a more concerted effort to better understand materials properties. We need not look far to see solder being used to interconnect ever finer geo metries. Assembly of micropassive discrete devices that are hardly visible to the unaided eye, of silicon chips directly to ceramic and plastic substrates, and of very fine peripheral leaded packages constitute a few of solder's uses. There has been a marked increase in university research related to solder. New electronic packaging centers stimulate applications, and materials engineering and science departments have demonstrated a new vigor to improve both the materials and our understanding of them. Industrial research and development continues to stimulate new application, and refreshing new packaging ideas are emerging. New handbooks have been published to help both the neophyte and seasoned packaging engineer.

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Solder Joint Reliability

Theory and Applications

Informace o knize

Kompletní popis

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