Testing of Interposer-Based 2.5D Integrated Circuits

Name: Testing of Interposer-Based 2.5D Integrated Circuits
Brand: Springer International Publishing AG
SKU: 9783319854618
Price: 2457 CZK
Availability: InStock

Autor: RAN WANG

Jazyk:

Vazba: Brožovaná

Vydavatel: Springer International Publishing AG

Dostupnost: Skladem u dodavatele

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This book provides readers with an insightful guide to the design, testing and optimization of 2.5D...

Informace o knize

Autor

RAN WANG

Jazyk

Angličtina

Vazba

Kniha - Brožovaná

Vydáno

2018

Stránek

182

EAN

9783319854618

ISBN

9783319854618

Enbook ID

19608059

Vydavatel

Springer International Publishing AG

Hmotnost

3051

Rozměry

155 x 235 x 10

Kompletní popis

This book provides readers with an insightful guide to the design, testing and optimization of 2.5D integrated circuits. The authors describe a set of design-for-test methods to address various challenges posed by the new generation of 2.5D ICs, including pre-bond testing of the silicon interposer, at-speed interconnect testing, built-in self-test architecture, extest scheduling, and a programmable method for low-power scan shift in SoC dies. This book covers many testing techniques that have already been used in mainstream semiconductor companies. Readers will benefit from an in-depth look at test-technology solutions that are needed to make 2.5D ICs a reality and commercially viable.

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Testing of Interposer-Based 2.5D Integrated Circuits

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