Více než 4 miliony titulů v angličtině i dalších jazycích! Objevte svůj nový příběh ještě dnes!

VLSI-SoC: Design Trends

Name: VLSI-SoC: Design Trends
Brand: Springer Nature Switzerland AG
SKU: 9783030816438
Price: 2970 CZK
Availability: InStock

28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, Salt Lake City, UT, USA, October 6-9, 2020, Revised and Extended Selected Papers

Autor: Andrea Calimera, Pierre-Emmanuel Gaillardon, Kunal Korgaonkar, Shahar Kvatinsky, Ricardo Reis

Jazyk:

Vazba: Brožovaná

Vydavatel: Springer Nature Switzerland AG

Dostupnost: Skladem u dodavatele

Odesíláme za 5-8 dnů

2 970 Kč

This book contains extended and revised versions of the best papers presented at the 28th IFIP WG 10...

Informace o knize

Autor

Andrea Calimera, Pierre-Emmanuel Gaillardon, Kunal Korgaonkar, Shahar Kvatinsky, Ricardo Reis

Jazyk

Angličtina

Vazba

Kniha - Brožovaná

Vydáno

2022

Stránek

364

EAN

9783030816438

Enbook ID

39335873

Vydavatel

Springer Nature Switzerland AG

Hmotnost

587

Rozměry

155 x 235 x 21

Kompletní popis

This book contains extended and revised versions of the best papers presented at the 28th IFIP WG 10.5/IEEE International Conference on Very Large Scale Integration, VLSI-SoC 2020, held in Salt Lake City, UT, USA, in October 2020.*The 16 full papers included in this volume were carefully reviewed and selected from the 38 papers (out of 74 submissions) presented at the conference. The papers discuss the latest academic and industrial results and developments as well as future trends in the field of System-on-Chip (SoC) design, considering the challenges of nano-scale, state-of-the-art and emerging manufacturing technologies. In particular they address cutting-edge research fields like low-power design of RF, analog and mixed-signal circuits, EDA tools for the synthesis and verification of heterogenous SoCs, accelerators for cryptography and deep learning and on-chip Interconnection system, reliability and testing, and integration of 3D-ICs.*The conference was held virtually.